Diffusion Bonding

Simulation of formation of morphological instabilities on both solidifying and melting fronts during transient-liquid-phase diffusion bonding of aluminium with copper interlayer

Transient-liquid-phase diffusion bonding with non-planar bond lines, which are favourable in terms of bond strength, can be achieved by imposing a temperature gradient upon the sample. PhasePot can be used to simulate unique features of this process, e.g. formation of morphological instabilities on the retreating melting front because of the so-called “constitutional superheating” effect. More information and examples on diffusion bonding of alloys.